Odisha Signs $3.3 Billion Semiconductor MoU With Intel, 3D Glass Solutions
BHUBANESWAR, India — The Odisha government has signed a memorandum of understanding with Intel and U.S.-based 3D Glass Solutions to set up an advanced packaging substrate manufacturing facility in the state, officials said Friday.
The project, described by the government as a first-of-its-kind initiative in India, is expected to bring in nearly $3.3 billion in foreign direct investment and strengthen Odisha’s position in the semiconductor supply chain.
The proposed facility will be established in Bhubaneswar in Khordha district and will include cleanrooms, fabrication units, testing infrastructure and research and development facilities.
According to an official statement, the facility will use advanced glass-based substrate technologies and high-density interconnect packaging, which are critical for artificial intelligence, high-performance computing, telecommunications and next-generation electronics.
Intel will serve as the technology partner for the project, providing process expertise, technology licensing, quality systems and workforce capability-building support.
The project will be implemented in phases and is expected to support the development of a broader semiconductor ecosystem in Odisha. Officials said the project could help attract companies involved in advanced materials, specialty chemicals, glass substrates, capital equipment manufacturing, electronics manufacturing, system integration and export-oriented industries.
The state government said the investment will help position Odisha as a hub for niche semiconductor technologies, particularly advanced packaging and materials engineering. It is also expected to support cluster-based industrialization and draw more global players to the state.
The project is expected to generate about 1,800 direct high-skilled jobs, along with a significant number of indirect employment opportunities. Officials said it would also strengthen academia-industry partnerships and support research, innovation and workforce training.
The Odisha government said the project aligns with its Vision 2036 roadmap, including its target of becoming a $500 billion economy by 2036 and a $1.5 trillion economy by 2047.
The project is also expected to increase state revenue through goods and services tax collections, ancillary industries and supply chain development, while boosting export earnings and strengthening Odisha’s long-term tax base.
“By attracting significant FDI, enabling semiconductor ecosystem development, creating high-quality jobs, and strengthening fiscal revenues, the project directly contributes to the state’s ambition of becoming a $500 billion economy by 2036 and $1.5 trillion by 2047,” an official statement said. (Source: IANS)
